JPS59208067A - 連続スパッタ装置 - Google Patents

連続スパッタ装置

Info

Publication number
JPS59208067A
JPS59208067A JP8268683A JP8268683A JPS59208067A JP S59208067 A JPS59208067 A JP S59208067A JP 8268683 A JP8268683 A JP 8268683A JP 8268683 A JP8268683 A JP 8268683A JP S59208067 A JPS59208067 A JP S59208067A
Authority
JP
Japan
Prior art keywords
plate
substrate
base plate
vacuum
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8268683A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6337185B2 (en]
Inventor
Katsuhiro Iwashita
岩下　克博
Hideki Tateishi
秀樹 立石
Tamotsu Shimizu
保 清水
Susumu Aiuchi
進 相内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8268683A priority Critical patent/JPS59208067A/ja
Publication of JPS59208067A publication Critical patent/JPS59208067A/ja
Publication of JPS6337185B2 publication Critical patent/JPS6337185B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP8268683A 1983-05-13 1983-05-13 連続スパッタ装置 Granted JPS59208067A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8268683A JPS59208067A (ja) 1983-05-13 1983-05-13 連続スパッタ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8268683A JPS59208067A (ja) 1983-05-13 1983-05-13 連続スパッタ装置

Publications (2)

Publication Number Publication Date
JPS59208067A true JPS59208067A (ja) 1984-11-26
JPS6337185B2 JPS6337185B2 (en]) 1988-07-25

Family

ID=13781299

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8268683A Granted JPS59208067A (ja) 1983-05-13 1983-05-13 連続スパッタ装置

Country Status (1)

Country Link
JP (1) JPS59208067A (en])

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6425600A (en) * 1987-07-22 1989-01-27 Matsushita Electric Ind Co Ltd Shielding device
JPH01169919A (ja) * 1987-12-25 1989-07-05 Hitachi Ltd 成膜装置
JPH0341844U (en]) * 1989-09-04 1991-04-22
US7094291B2 (en) 1990-05-18 2006-08-22 Semitool, Inc. Semiconductor processing apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5399081A (en) * 1977-02-10 1978-08-30 Mitsubishi Electric Corp Sputtering apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5399081A (en) * 1977-02-10 1978-08-30 Mitsubishi Electric Corp Sputtering apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6425600A (en) * 1987-07-22 1989-01-27 Matsushita Electric Ind Co Ltd Shielding device
JPH01169919A (ja) * 1987-12-25 1989-07-05 Hitachi Ltd 成膜装置
JPH0341844U (en]) * 1989-09-04 1991-04-22
US7094291B2 (en) 1990-05-18 2006-08-22 Semitool, Inc. Semiconductor processing apparatus
US7138016B2 (en) 1990-05-18 2006-11-21 Semitool, Inc. Semiconductor processing apparatus

Also Published As

Publication number Publication date
JPS6337185B2 (en]) 1988-07-25

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